Reducing the risk of failure with flexible composite stamps

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Microelectronic Engineering 2016 / 3

Reducing the risk of failure with flexible composite stamps

Papenheim, Marc, Eidemüller, Wolfgang, Wang, Si, Steinberg, Christian, Scheer, Hella-Christin
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Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2016.02.048
Date:
March, 2016
File:
PDF, 727 KB
english, 2016
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