[IEEE 2015 6th Asia Symposium on Quality Electronic Design (ASQED) - Kula Lumpur, Malaysia (2015.8.4-2015.8.5)] 2015 6th Asia Symposium on Quality Electronic Design (ASQED) - Electromigration failure mechanism comparison between wafer level and package level reliability test on via structure
Dulin, Wang, Nee, Ong Cheng, Seng, Ng HongYear:
2015
Language:
english
DOI:
10.1109/acqed.2015.7274013
File:
PDF, 294 KB
english, 2015