[IEEE 2014 IEEE Electrical Design of Advanced Packaging...

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[IEEE 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) - Bangalore, India (2014.12.14-2014.12.16)] 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) - EMC-aware analysis and design of a low-cost receiver circuit under injection locking and pulling

Huynen, Martijn, Stockman, Gert-Jan, Declercq, Frederick, Torfs, Guy, Bauwelinck, Johan, Vande Ginste, Dries
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Year:
2014
Language:
english
DOI:
10.1109/edaps.2014.7030830
File:
PDF, 221 KB
english, 2014
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