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[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Engineered interfaces for enhanced oxidation/corrosion resistance of ultra thin pre-plated leadframes
Liu, Lilin, Fu, Ran, Liu, Deming, Zhang, Tong-YiYear:
2006
Language:
english
DOI:
10.1109/emap.2006.4430599
File:
PDF, 2.40 MB
english, 2006