[IEEE 2015 16th International Conference on Thermal,...

[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Advances in percolated thermal underfill (PTU) simulations for 3D-integration

Kumar, S. G., Zschenderlein, U., Pantou, R., Brunschwiler, T., Schlottig, G., Schindler-Saefkow, F., Wunderle, B.

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Year:

2015

Language:

english

DOI:

10.1109/eurosime.2015.7103126

File:

PDF, 1.58 MB

english, 2015

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