[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Silicon level circuit implementation for system-on-chip power integrity improvement
Aw, Chee Hong, Quek, Li Chuang, Shu, Heng ChuanYear:
2015
Language:
english
DOI:
10.1109/icep-iaac.2015.7111109
File:
PDF, 592 KB
english, 2015