[IEEE 2014 International Conference on Planarization/CMP Technology (ICPT) - Kobe, Japan (2014.11.19-2014.11.21)] Proceedings of International Conference on Planarization/CMP Technology 2014 - Effect of mechanical polishing on copper in electrochemical-mechanical polishing
Shiu, Pei-Jiun R., Chen, Chao-Chang A., Shiu, Pei-Jiun R.Year:
2014
DOI:
10.1109/icpt.2014.7017310
File:
PDF, 390 KB
2014