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[IEEE 2014 IEEE 36th International Electronics Manufacturing Technology Conference (IEMT) - Johor, Malaysia (2014.11.11-2014.11.13)] 36th International Electronics Manufacturing Technology Conference - Effects of copper particle size on creep deformation in copper paste films
Fukuda, Shinji, Shimada, Kazuhiko, Izu, Noriya, Shin, Woosuck, Hirao, Kiyoshi, Sandou, Mutsuo, Murayama, NorimitsuYear:
2014
Language:
english
DOI:
10.1109/iemt.2014.7123097
File:
PDF, 1.62 MB
english, 2014