Prevention of Cracking From RDL Stress and Dicing Defects...

IEEE Transactions on Device and Materials Reliability 2016 / 3 Vol. 16; Iss. 1

Prevention of Cracking From RDL Stress and Dicing Defects in Glass Substrates

McCann, Scott, Sato, Yoichiro, Sundaram, Venkatesh, Tummala, Rao R., Sitaraman, Suresh K.
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Volume:
16
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2015.2507978
Date:
March, 2016
File:
PDF, 1.78 MB
english, 2016
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