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SPIE Proceedings [SPIE Microelectronic Manufacturing '95 - Austin, TX, United States (Wednesday 25 October 1995)] Microelectronic Manufacturing Yield, Reliability, and Failure Analysis - Temperature and current density distributions in via structures with inhomogenous step coverages
Weide, Kirsten, Ullmann, JensVolume:
2635
Year:
1995
Language:
english
DOI:
10.1117/12.221445
File:
PDF, 478 KB
english, 1995