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SPIE Proceedings [SPIE Seventh International Symposium on Precision Engineering Measurements and Instrumentation - Yunnan, China (Sunday 7 August 2011)] Seventh International Symposium on Precision Engineering Measurements and Instrumentation - Design and characterization of a chip defect inspection system during bonding process based on linear CCD imager
Chen, Ming-Fu, Fan, Kuang-Chao, Song, Man, Huang, Po-Hsuan, Chen, Yung-Hsiang, Lu, Rong-Sheng, Huang, Ting-Ming, Chang, MingVolume:
8321
Year:
2011
Language:
english
DOI:
10.1117/12.905129
File:
PDF, 2.16 MB
english, 2011