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Thin-Copper-Metal Interconnection Thermomigration Analysis in ESD Regime
Di Biccari, Leonardo, Cerati, Lorenzo, Pozzobon, Fiorella, Zullino, Lucia, Morin, Sonia, Pizzo, Giansalvo, Boroni, Andrea, Andreini, AntonioVolume:
15
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2015.2463071
Date:
September, 2015
File:
PDF, 3.14 MB
english, 2015