Shear test parameters for brittle fracture of flip chip...

Materials Science and Technology 2011 / 03 Vol. 27; Iss. 3

Shear test parameters for brittle fracture of flip chip solder joint

Ha, S-S, Kim, J-W, Ha, S-O, Jung, S-B
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Volume:
27
Language:
english
Journal:
Materials Science and Technology
DOI:
10.1179/174328409x453244
Date:
March, 2011
File:
PDF, 1.92 MB
english, 2011
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