[IEEE 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hsinchu (2015.6.29-2015.7.2)] 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits - Evaluation of copper nanoparticles for low temperature bonded interconnections
Byung Hoon Lee,, Mei Zhen Ng,, Zinn, Alfred A., Chee Lip Gan,Year:
2015
Language:
english
DOI:
10.1109/ipfa.2015.7224343
File:
PDF, 1.11 MB
english, 2015