An Assessment of Risk of Fracture During Wirebond Over...

IEEE Transactions on Components Packaging and Manufacturing Technology 2016 / 2 Vol. 6; Iss. 2

An Assessment of Risk of Fracture During Wirebond Over Active Circuits on ULK Dies

Upreti, Kritika, Lin, Hung-Yun, Subbarayan, Ganesh, Jung, Dae Young, Sammakia, Bahgat G.
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Volume:
6
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2015.2466679
Date:
February, 2016
File:
PDF, 3.34 MB
english, 2016
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