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[IEEE 2009 IEEE International Conference on 3D System Integration (3DIC) - San Francisco, CA, USA (2009.09.28-2009.09.30)] 2009 IEEE International Conference on 3D System Integration - Fabrication and packaging of microbump interconnections for 3D TSV
Yoon, Seung Wook, Ku, Jae Hoon, Suthiwongsunthorn, Nathapong, Marimuthu, Pandi Chelvam, Carson, FlynnYear:
2009
Language:
english
DOI:
10.1109/3DIC.2009.5306554
File:
PDF, 985 KB
english, 2009