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[IEEE 2010 IEEE International 3D Systems Integration Conference (3DIC) - Munich, Germany (2010.11.16-2010.11.18)] 2010 IEEE International 3D Systems Integration Conference (3DIC) - High performance 3D interconnects based on electrochemical etch and liquid metal fill
Hedler, Harry, Scheiter, Thomas, Schieber, Markus, Klumpp, Armin, Ramm, PeterYear:
2010
Language:
english
DOI:
10.1109/3dic.2010.5751449
File:
PDF, 820 KB
english, 2010