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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - WLCSP+ and eWLCSP in FlexLine: Innovative Wafer Level Package manufacturing
Lin, Yaojian, Chong, Eric, Chan, Mark, Lim, Kok Hwa, Yoon, Seung WookYear:
2015
Language:
english
DOI:
10.1109/ectc.2015.7159694
File:
PDF, 885 KB
english, 2015