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[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Test wrapper bandwidth assignment for minimizing the SoC test application time
Cheng-Hsun Nien,, Chun-Hua Cheng,, Shih-Hsu Huang,Year:
2015
Language:
english
DOI:
10.1109/impact.2015.7365237
File:
PDF, 838 KB
english, 2015