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Monolithic 3D TSV-based high-voltage, high-temperature capacitors
Gruenler, Saeideh, Rattmann, Gudrun, Erlbacher, Tobias, Bauer, Anton J., Frey, LotharLanguage:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2016.02.008
Date:
February, 2016
File:
PDF, 2.00 MB
english, 2016