[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - Hot spots suppression by high thermal conductivity film in thin-sub strate CMOS ICs for 3D integration
Kato, Fumiki, Kikuchi, Katsuya, Nakagawa, Hiroshi, Aoyagi, MasahiroYear:
2012
DOI:
10.1109/3dic.2012.6263005
File:
PDF, 1.06 MB
2012