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[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Fault isolation of short defect in through silicon via (TSV) based 3D-IC
Jung, Daniel H., Cho, Jonghyun, Kim, Heegon, Kim, Jonghoon J., Kim, Hongseok, Kim, Joungho, Bae, Hyun-Cheol, Choi, Kwang-SeongYear:
2013
Language:
english
DOI:
10.1109/3dic.2013.6702376
File:
PDF, 277 KB
english, 2013