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[IEEE 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) - Bangalore, India (2014.12.14-2014.12.16)] 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) - Indirect contact probing method for characterizing via arrays in electronic packaging
Jeong, JongWoo, Kim, Jingook, Han, Ki Jin, Kang, No-WeonYear:
2014
Language:
english
DOI:
10.1109/edaps.2014.7030805
File:
PDF, 1.87 MB
english, 2014