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[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - The Evolution of CPU Packaging Technology and Future Challenges
Oh, Boon Howe, Lee, Eng Kwong, Loo, Howe Yin, Oh, Poh TatYear:
2006
Language:
english
DOI:
10.1109/emap.2006.4430605
File:
PDF, 2.66 MB
english, 2006