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[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Creep corrosion failure analysis on ENIG printed circuit boards
Fu, Haley, Lee, Dem, Lee, Jeffrey, Tong, Geoffrey, Lee, Simon, Singh, Prabjit, Kazi, Aamir, Nailos, Mary, Ables, Wallace, Guo, Karlos, Jiang, GuoDongYear:
2015
Language:
english
DOI:
10.1109/impact.2015.7365207
File:
PDF, 11.39 MB
english, 2015