Development of Au reflection film with high adhesion for...

IEEE Transactions on Components and Packaging Technologies 2006 / 3 Vol. 29; Iss. 1

Development of Au reflection film with high adhesion for high-density optical interconnection between LSI chips

Yokota, K., Satoh, R., Iwata, Y., Fujimoto, K., Ura, S., Kintaka, K.
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.850513
Date:
March, 2006
File:
PDF, 1.19 MB
english, 2006
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