[IEEE 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, South Korea (2015.12.14-2015.12.16)] 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Electrical characteristics analysis and comparison between through silicon via(TSV) and through glass via(TGV)
Kim, Jihye, Hwang, Insu, Kim, Youngwoo, Kim, Heegon, Kim, Joungho, Sundaram, Venky, Tummala, RaoYear:
2015
Language:
english
DOI:
10.1109/edaps.2015.7383676
File:
PDF, 568 KB
english, 2015