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[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Self Assembly of Microcomponents on Patterned Substrate Using Capillary Force
Balakrishnan, S., Kripesh, V., Teo Poi Siong,, Iyer, M.K.Volume:
1
Year:
2005
Language:
english
DOI:
10.1109/eptc.2005.1614384
File:
PDF, 2.53 MB
english, 2005