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[IEEE 2014 International Conference on Planarization/CMP Technology (ICPT) - Kobe, Japan (2014.11.19-2014.11.21)] Proceedings of International Conference on Planarization/CMP Technology 2014 - Ruthenium and Copper CMP in periodate-based slurry with BTA and K2MoO4 as compound corrosion inhibitors
Cheng, Jie, Wang, Tongqing, Wang, Jie, He, Yongyong, Lu, XinchunYear:
2014
Language:
english
DOI:
10.1109/icpt.2014.7017283
File:
PDF, 412 KB
english, 2014