[IEEE 2014 IEEE 36th International Electronics...

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[IEEE 2014 IEEE 36th International Electronics Manufacturing Technology Conference (IEMT) - Johor, Malaysia (2014.11.11-2014.11.13)] 36th International Electronics Manufacturing Technology Conference - A novel epoxy flux on solder paste for assembling thermally warped POP

Hu, Ming, Kresge, Lee, Lee, Ning-Cheng
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Year:
2014
Language:
english
DOI:
10.1109/iemt.2014.7123074
File:
PDF, 2.83 MB
english, 2014
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