[IEEE IEEE 2005 International Interconnect Technology Conference - Burlingame, CA, USA (6-8 June 2005)] Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005. - Impacts of UV cure for reliable porous PECVD SiOC integration [IC interconnect applications]
Yoneda, K., Kato, M., Kondo, S., Kobayashi, N., Matsuki, N., Matsushita, K., Ohara, N., Fukazawa, A., Kimura, T.Year:
2005
Language:
english
DOI:
10.1109/iitc.2005.1499989
File:
PDF, 530 KB
english, 2005