A Study on the Diffuse Mechanism and the Barrier Property...

IEEE Journal of the Electron Devices Society 2015 / 5 Vol. 3; Iss. 3

A Study on the Diffuse Mechanism and the Barrier Property of Copper Manganese Alloy on Tantalum

Su, Ying-Sen, Lee, Wen-Hsi, Chang, Shih-Chieh, Wang, Ying-Lang
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Volume:
3
Language:
english
Journal:
IEEE Journal of the Electron Devices Society
DOI:
10.1109/jeds.2014.2358588
Date:
May, 2015
File:
PDF, 4.22 MB
english, 2015
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