Through-Si-via (TSV) Keep-Out-Zone (KOZ) in SOI Photonics...

IEEE Photonics Journal 2013 / 12 Vol. 5; Iss. 6

Through-Si-via (TSV) Keep-Out-Zone (KOZ) in SOI Photonics Interposer: A Study of the Impact of TSV-Induced Stress on Si Ring Resonators

Yang, Yan, Yu, Mingbin, Rusli,, Fang, Qing, Song, Junfeng, Ding, Liang, Lo, Guo-Qiang
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Volume:
5
Language:
english
Journal:
IEEE Photonics Journal
DOI:
10.1109/jphot.2013.2285707
Date:
December, 2013
File:
PDF, 1.06 MB
english, 2013
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