[IEEE 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) - Brasov, Romania (2015.10.22-2015.10.25)] 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) - Effect of solder joint volume on its shear fracture mode
Garami, Tamas, Krammer, OliverYear:
2015
Language:
english
DOI:
10.1109/siitme.2015.7342301
File:
PDF, 1.52 MB
english, 2015