Modeling the interdependence of processing and alloy...

IEEE Transactions on Components and Packaging Technologies 2006 / 3 Vol. 29; Iss. 1

Modeling the interdependence of processing and alloy composition on the evolution of microstructure in Sn-based lead-free solders in fine pitch flip chip

Zhiheng Huang,, Conway, P.P., Changqing Liu,, Thomson, R.C.
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Volume:
29
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.850538
Date:
March, 2006
File:
PDF, 688 KB
english, 2006
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