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[IEEE 2015 IEEE Electrical Design of Advanced Packaging and...

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[IEEE 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, South Korea (2015.12.14-2015.12.16)] 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Wideband equivalent circuit model for a through silicon via with effective substrate current loop

Kim, Kibeom, Hwang, Karam, Ahn, Seungyoung
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Year:
2015
DOI:
10.1109/edaps.2015.7383663
File:
PDF, 1.07 MB
2015
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