[IEEE 2015 16th International Conference on Thermal,...

[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Reliability analysis of copper bump interconnection in double-sided power module

Chia-Chi Tsai,, Li-Ling Liao,, Yen-Fu Su,, Hung, Tuan-Yu, Chiang, Kuo-Ning

How much do you like this book?

What’s the quality of the file?

Download the book for quality assessment

What’s the quality of the downloaded files?

Year:

2015

DOI:

10.1109/eurosime.2015.7103093

File:

PDF, 748 KB

2015

Conversion to is in progress

Conversion to is failed