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[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Comparison of thermal characteristics of Light-emitting Diode chips and electrical heating source
Wang, Xiaodong, Zhou, Chuanpeng, Li, Congming, Li, Zhixin, Luo, YiYear:
2015
DOI:
10.1109/icept.2015.7236667
File:
PDF, 637 KB
2015