Redistribution of pads on a singulated IC die using laser...

IEEE Transactions on Components and Packaging Technologies 2006 / 3 Vol. 29; Iss. 1

Redistribution of pads on a singulated IC die using laser direct-write ablation

Chengping Zhang,, Bartholomew, R., Karulkar, P.C.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
29
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2006.870393
Date:
March, 2006
File:
PDF, 1.19 MB
2006
Conversion to is in progress
Conversion to is failed