[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Processing active devices on Si interposer and impact on cost
Velenis, D., Detalle, M., Hellings, G., Scholz, M., Marinissen, E.J., Van der Plas, G., La Manna, A., Miller, A., Linten, D., Beyne, E.Year:
2015
Language:
english
DOI:
10.1109/3dic.2015.7334620
File:
PDF, 807 KB
english, 2015