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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Thermomechanical reliability of gold stud bump bonding for large volume MEMS devices
Visser Taklo, Maaike M., Wright, Daniel Nilsen, Vardoy, Astrid-Sofie, Attard, Alastair, Hajdarevic, Zlatko, Bulacher, Stephan, Saliba, Mario, Wijgaerts, Jan, Borg, Joshua, Vella, David OscarYear:
2015
Language:
english
DOI:
10.1109/ECTC.2015.7159774
File:
PDF, 1.35 MB
english, 2015