[IEEE 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2015.10.21-2015.10.23)] 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Enrichment of annealing twins in an Ag-4Pd bonding wire for electronic packaging
Chuang, Chien-Hsun, Tsai, Chih-Hsin, Lee, Jun-Der, Tsai, Hsing-HuaYear:
2015
Language:
english
DOI:
10.1109/IMPACT.2015.7365194
File:
PDF, 1.18 MB
english, 2015