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[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging
Wunderle, B., Auersperg, A., Grosser, V., Kaulfersch, E., Wittler, O., Michel, B.Year:
2003
Language:
english
DOI:
10.1109/dtip.2003.1287063
File:
PDF, 547 KB
english, 2003