[IEEE Symposium on Design, Test, Integration and Packaging...

  • Main
  • [IEEE Symposium on Design, Test,...

[IEEE Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Cannes, France (5-7 May 2003)] Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003. - Modular parametric finite element modelling for reliability-studies in electronic and MEMS packaging

Wunderle, B., Auersperg, A., Grosser, V., Kaulfersch, E., Wittler, O., Michel, B.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2003
Language:
english
DOI:
10.1109/dtip.2003.1287063
File:
PDF, 547 KB
english, 2003
Conversion to is in progress
Conversion to is failed