[IEEE 53rd Electronic Components and Technology Conference,...

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Evaluation of manufacturing assembly process impact on long term reliability of a high performance ASIC using flip chip hyperBGA pacuage

Jie Xue,, Hubbard, K., Li, P., Tang, J., Poom, J., Brillhart, M., Alcoe, D., Kunz, R., Mendez, D.

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Year:

2003

Language:

english

DOI:

10.1109/ectc.2003.1216302

File:

PDF, 537 KB

english, 2003

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