[IEEE 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, South Korea (2015.12.14-2015.12.16)] 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Fast insertion loss estimation method for meshed ground by shape conversion
Shim, Minkyu, Yu, Jiheon, Baek, Hyunho, Lee, Junho, Kim, Joong-HoYear:
2015
Language:
english
DOI:
10.1109/edaps.2015.7383684
File:
PDF, 569 KB
english, 2015