[IEEE 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, South Korea (2015.12.14-2015.12.16)] 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Electric and magnetic field shielding evaluation of board level shield can using TEM cell
Jang, Hyuntae, Lim, Jaedeok, Lee, Yongwon, Lee, Hosang, Nah, WansooYear:
2015
Language:
english
DOI:
10.1109/edaps.2015.7383710
File:
PDF, 392 KB
english, 2015