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[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - The indentation size effect in SnAgCu lead-free BGA solder joints at elevated temperatures
Kong, Xiangxia, Sun, Fenglian, Yang, MiaosenYear:
2015
Language:
english
DOI:
10.1109/icept.2015.7236796
File:
PDF, 612 KB
english, 2015