[IEEE 2000 22nd International Conference on Microelectronics. Proceedings - Nis, Yugoslavia (14-17 May 2000)] 2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400) - Thermal simulation of high-lead count packages
Hanreich, G., Musiejovsky, L., Nicolics, J., Riedling, K.Volume:
1
Year:
1999
Language:
english
DOI:
10.1109/icmel.2000.840587
File:
PDF, 506 KB
english, 1999