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Fabrication and Characterization of Polymer-Enhanced TSVs, Inductors, and Antennas for Mixed-Signal Silicon Interposer Platforms
Thadesar, Paragkumar A., Bakir, Muhannad S.Volume:
6
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2015.2511067
Date:
March, 2016
File:
PDF, 4.42 MB
english, 2016