Multi-Strata Stealth Dicing Before Grinding for...

IEEE Transactions on Semiconductor Manufacturing 2015 / 8 Vol. 28; Iss. 3

Multi-Strata Stealth Dicing Before Grinding for Singulation-Defects Elimination and Die Strength Enhancement: Experiment and Simulation

Weng Hong Teh,, Boning, Duane S., Welsch, Roy E.
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/tsm.2015.2438875
Date:
August, 2015
File:
PDF, 4.36 MB
english, 2015
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